HyperX DDR3 Memory is Here!

HyperX DDR3* features:

• 1.7 Volts operation
• Memory signal termination inside the memory chip (On-Die Termination) to prevent reflected signal transmission errors
• Operational enhancements to increase memory performance, efficiency and timing margins
• CAS Latencies: 5 (Ultra Low Latency) and 7 (Low Latency)
• Currently available in speeds up to 2GHz and capacities of 2GB, 3GB, and 4GB kits
• DDR3 memory modules are not backward compatible to DDR2 and DDR based motherboards, due to incompatible module connections (number of pins), voltage and DRAM technology. DDR3 memory modules have a different key or notch than the same-sized DDR and DDR2 modules to prevent their insertion into an incompatible memory socket. HyperX modules are available in single, dual and triple-channel memory kits.